Patent Assignment
Reel/Frame 039306/0617
Assignment of Assignor's Interest
Recorded: 2016-08-01
Pages: 3
Assignor
YAMAMOTO, SUKEHIRO
Executed: 2016-07-29
Assignee
SII SEMICONDUCTOR CORPORATION
8, NAKASE 1-CHOME, MIHAMA-KU, CHIBA-SHI, CHIBA, 261-8507, JAPAN
Covered Property
(1)
Polishing Head, Cmp Apparatus Having Polishing Head, and Semiconductor Integrated Circuit Manufacturing Method Using Cmp Apparatus
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.