Patent Assignment
Reel/Frame 039392/0859
Assignment of Assignor's Interest
Recorded: 2016-08-10
Pages: 4
Assignors
TESHIMA, YUICHIRO
Executed: 2016-06-17
NAKAISO, TOSHIYUKI
Executed: 2016-06-16
TAKESHIMA, YUTAKA
Executed: 2016-06-16
Assignee
MURATA MANUFACTURING CO., LTD.
10-1, HIGASHIKOTARI 1-CHOME, NAGAOKAKYO-SHI, KYOTO-FU, 617-8555, JAPAN
Covered Property
(1)
Semiconductor Package and Mounting Structure Thereof