Patent Assignment
Reel/Frame 039397/0248
Assignment of Assignor's Interest
Recorded: 2016-08-10
Pages: 4
Assignors
HUNG, HUA-LI
Executed: 2016-08-03
LU, CHIH-LUN
Executed: 2016-08-03
HUANG, HSU-YU
Executed: 2016-08-03
YIN, TSUNG-FAN
Executed: 2016-08-03
HSIA, YING-TING
Executed: 2016-08-03
CHIU, YI-WEI
Executed: 2016-08-03
HSU, LI-TE
Executed: 2016-08-03
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Structure and Formation Method of Interconnection Structure of Semiconductor Device