IP Library Assignment 039398/0672
Patent Assignment
Reel/Frame 039398/0672

Assignment of Assignor's Interest

Recorded: 2016-08-10 Pages: 4
Assignors
EDELEN, JOHN GLENN
Executed: 2014-08-26
SEMLER, NICOLE
Executed: 2014-08-27
MARRA, MICHAEL
Executed: 2014-08-27
Assignee
FUNAI ELECTRIC CO., LTD
7-1 NAKAGAITO 7-CHOME, DAITO, OSAKA, 5740013, JAPAN
Covered Property (1)
Chip Layout to Enable Multiple Heater Chip Vertical Resolutions
Patent: 9,802,404 →
Application: 15/233,769 →
Publication: US 2016/0347062
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 3, 2025
From: FUNAI ELECTRIC CO., LTD.
To: BRADY WORLDWIDE, INC.
Reel/Frame 070724/0313 →