Patent Assignment
Reel/Frame 039439/0430
CHANGE OF NAME
Recorded: 2016-07-22
Received: 2016-07-22
Pages: 5
Assignor
STATS CHIPPAC LTD.
Executed: 2016-03-29
Assignee
STATS CHIPPAC PTE. LTD.
10 ANG MO KIO STREET 65, #04-08/09 TECHPOINT, SINGAPORE, SGX, 569059, SINGAPORE
Covered Applications
(8)
Set of components for upgrading a lock
App. No. 29/620,127
→
RETRACTABLE LATCH BOLT ASSEMBLIES FOR UPGRADING LOCKS
App. No. 14/999,867
→
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SHIELDING AND METHOD OF MANUFACTURE THEREOF
App. No. 15/091,049
→
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SUPPORT STRUCTURE AND METHOD OF MANUFACTURE THEREOF
App. No. 14/316,190
→
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PLATED COPPER POSTS AND METHOD OF MANUFACTURE THEREOF
App. No. 14/227,346
→
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CORELESS SUBSTRATE AND METHOD OF MANUFACTURE THEREOF
App. No. 14/226,711
→
INTERPOSER SUBSTRATE DESIGNS FOR SEMICONDUCTOR PACKAGES
App. No. 14/039,938
→
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH UNPLATED LEADFRAME AND METHOD OF MANUFACTURE THEREOF
App. No. 13/930,287
→