Patent Assignment
Reel/Frame 039463/0146
Assignment of Assignor's Interest
Recorded: 2016-08-17
Pages: 8
Assignors
ADY, ROGER
Executed: 2016-06-28
BOWERS, MORRIS
Executed: 2016-06-29
CROSBIE, PAUL
Executed: 2016-06-29
Assignee
MOTOROLA MOBILITY LLC
222 WEST MERCHANDISE MART PLAZA, SUITE 1800, CHICAGO, ILLINOIS, 60654
Covered Property
(1)
Chip Package Stack Up for Heat Dissipation
Patent:
9,698,132 →
Application:
15/238,849 →