Patent Assignment
Reel/Frame 039492/0349
Assignment of Assignor's Interest
Recorded: 2016-08-21
Pages: 4
Assignor
LIU, JIQUAN
Executed: 2016-08-02
Assignees
SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION
NO. 18, WEN CHANG RD., ECONOMIC-TECHNOLOGICAL DEVELOPMENT AREA, DAXING DISTRICT, BEIJING, 100716, CHINA
SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
18 ZHANGJIANG ROAD, PUDONG NEW AREA, SHANGHAI, 201203, CHINA
Covered Property
(1)
Metal Interconnect Structure and Fabrication Method Thereof