IP Library › Assignment 039509/0979
Patent Assignment
Reel/Frame 039509/0979

Assignment of Assignor's Interest

Recorded: 2016-08-23 Pages: 4
Assignors
ZHAO, SAM ZIQUN
Executed: 2016-04-26
KHAN, REZAUR RAHMAN
Executed: 2016-04-27
Assignee
BROADCOM CORPORATION
5300 CALIFORNIA AVE., IRVINE, CALIFORNIA, 92617
Covered Property (1)
Wafer Level System in Package (Sip) Using a Reconstituted Wafer and Method of Making
Patent: 9,842,827 →
Application: 15/144,458 →
Publication: US 2017/0301651
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 1, 2017
From: BROADCOM CORPORATION
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041706/0001 →
Merger Oct 5, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047422/0464 →
Corrective Assignment to Correct the Execution Date Previously Recorded at Reel: 047422 Frame: 0464. Assignor(S) Hereby Confirms the Merger. Mar 6, 2019
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 048883/0702 →