Patent Assignment
Reel/Frame 039514/0699
Assignment of Assignor's Interest
Recorded: 2016-08-24
Pages: 9
Assignors
LEE, CHANGHYUN
Executed: 2016-08-02
LEE, HEONKYU
Executed: 2016-07-27
KANG, SHINHWAN
Executed: 2016-07-29
PARK, YOUNGWOO
Executed: 2016-05-26
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Three-Dimensional Semiconductor Device with Vertical and Horizontal Channels in Stack Structure Having Electrodes Vertically Stacked on the Substrate