Patent Assignment
Reel/Frame 039564/0779
Assignment of Assignor's Interest
Recorded: 2016-08-29
Pages: 7
Assignors
WU, YUNG-HSU
Executed: 2014-09-29
TSAI, CHENG-HSIUNG
Executed: 2014-09-29
CHANG, YU-SHENG
Executed: 2014-10-07
WU, CHIA-TIEN
Executed: 2014-09-29
LEE, CHUNG-JU
Executed: 2014-09-29
YEN, YUNG-SUNG
Executed: 2014-09-29
CHEN, CHUN-KUANG
Executed: 2014-09-30
BAO, TIEN-I
Executed: 2014-09-24
LIU, RU-GUN
Executed: 2014-09-30
SHUE, SHAU-LIN
Executed: 2014-09-30
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Method of Forming an Interconnect Structure for a Semiconductor Device