Patent Assignment
Reel/Frame 039582/0747
Assignment of Assignor's Interest
Recorded: 2016-08-30
Pages: 5
Assignors
KUMBHAT, NITESH
Executed: 2016-08-29
SUN, LI
Executed: 2016-08-29
LEE, AARON
Executed: 2016-08-30
CHOI, DEOG-SOON
Executed: 2016-08-30
KU, HYUN-MO
Executed: 2016-08-30
Assignee
AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
NO. 1 YISHUN AVENUE 7, SINGAPORE, 768923, SINGAPORE
Covered Property
(1)
Printed Circuit Board (Pcb) and Pcb Assembly Having an Encapsulating Mold Material on a Bottom Surface Thereof and Methods for Molding an Encapsulating Mold Material on a Bottom Surface of a Pcb
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
May 9, 2017
From: AJOIAN, JACK
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 042293/0810 →
Merger
Oct 5, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047422/0464 →
Corrective Assignment to Correct the Execution Date Previously Recorded at Reel: 047422 Frame: 0464. Assignor(S) Hereby Confirms the Merger.
Mar 6, 2019
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 048883/0702 →