Patent Assignment
Reel/Frame 039661/0911
Assignment of Assignor's Interest
Recorded: 2016-09-07
Pages: 4
Assignors
HUANG, YU-LUNG
Executed: 2016-09-06
LIU, TSANG-YU
Executed: 2016-09-06
CHANG, YI-MING
Executed: 2016-09-06
KUAN, HSIN
Executed: 2016-09-06
Assignee
XINTEC INC.
9F., NO. 23, JILIN RD., JHONGLI INDUSTRIAL PARK, JHONGLI DIST., TAOYUAN CITY, 32062, TAIWAN
Covered Property
(1)
Chip Package and Method for Forming the Same