Patent Assignment
Reel/Frame 039703/0821
Assignment of Assignor's Interest
Recorded: 2016-09-12
Pages: 12
Assignors
CHEN, HSIA-WEI
Executed: 2013-11-26
CHU, WEN-TING
Executed: 2013-11-26
TU, KUO-CHI
Executed: 2013-11-26
CHANG, CHIH-YANG
Executed: 2013-11-26
YANG, CHIN-CHIEH
Executed: 2013-11-26
LIAO, YU-WEN
Executed: 2013-11-26
YOU, WEN-CHUN
Executed: 2013-11-27
SHIH, SHENG-HUNG
Executed: 2013-11-26
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Top Electrode for Device Structures in Interconnect