Assignment of Assignor's Interest

Recorded: 2016-09-13 Pages: 3

Assignor

ITO, MAMI

Executed: 2016-09-02

Assignee

SII SEMICONDUCTOR CORPORATION

8, NAKASE 1-CHOME, MIHAMA-KU, CHIBA-SHI, CHIBA, 261-8507, JAPAN

Covered Property (1)

Semiconductor Device, Lead Frame, and Method of Manufacturing Lead Frame

Application: 15/264,101 →

Publication: US 2017/0084547

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.