Patent Assignment
Reel/Frame 039720/0977
Assignment of Assignor's Interest
Recorded: 2016-09-13
Pages: 3
Assignor
TAMAKI, ICHIRO
Executed: 2016-09-12
Assignee
SII SEMICONDUCTOR CORPORATION
8, NAKASE 1-CHOME, MIHAMA-KU, CHIBA-SHI, CHIBA, 261-8507, JAPAN
Covered Property
(1)
Semiconductor-Substrate Processing Apparatus, Method of Stripping a Photoresist, and Method of Manufacturing a Semiconductor Device
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.