Patent Assignment
Reel/Frame 039870/0179
Assignment of Assignor's Interest
Recorded: 2016-09-27
Pages: 3
Assignor
BEYNE, ERIC
Executed: 2016-09-05
Assignee
IMEC VZW
KAPELDREEF 75, LEUVEN, 3001, BELGIUM
Covered Property
(1)
Method for Bonding and Interconnecting Integrated Circuit Devices