IP Library › Assignment 040152/0561
Patent Assignment
Reel/Frame 040152/0561

Assignment of Assignor's Interest

Recorded: 2016-10-27 Pages: 3
Assignor
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO (MAETAN-DONG), YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Properties (2)
Semiconductor Interconnect Structure Having a Graphene-Based Barrier Metal Layer
Patent: 9,324,634 →
Application: 13/291,470 →
Publication: US 2013/0113102
Semiconductor Interconnect Structure Having a Graphene-Based Barrier Metal Layer
Patent: 9,324,635 →
Application: 14/525,886 →
Publication: US 2015/0041981
Related Assignments (2)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 8, 2011
From: BAO, JUNJING; YAO, SHAONING; LI, XUESONG; CHOI, SAMUEL S. S.
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 027192/0393 →
Assignment of Assignor's Interest Oct 28, 2014
From: BAO, JUNJING; CHOI, SAMUEL S. S.; LI, XUESONG; YAO, SHAONING
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 034052/0976 →