Patent Assignment
Reel/Frame 040159/0893
Assignment of Assignor's Interest
Recorded: 2016-10-28
Pages: 3
Assignors
FUJII, MIKA
Executed: 2016-10-06
HIGASH, KAZUYUKI
Executed: 2016-10-18
TSUMURA, KAZUMICHI
Executed: 2016-10-17
SHIRONO, TAKASHI
Executed: 2016-10-07
Assignee
KABUSHIKI KAISHA TOSHIBA
1-1, SHIBAURA 1 CHOME, MINATO KU, TOKYO, 105-8001, JAPAN
Covered Property
(1)
Method of Bonding Supporting Substrate with Device Substrate for Fabricating Semiconductor Device
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 14, 2017
From: KABUSHIKI KAISHA TOSHIBA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 043194/0647 →
Merger
Jan 22, 2021
From: TOSHIBA MEMORY CORPORATION
To: K.K. PANGEA
Reel/Frame 055659/0471 →
Change of Name and Address
Jan 22, 2021
From: TOSHIBA MEMORY CORPORATION
To: KIOXIA CORPORATION
Reel/Frame 055669/0001 →
Change of Name and Address
Jan 22, 2021
From: K.K. PANGEA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 055669/0401 →