Assignment of Assignor's Interest

Recorded: 2016-10-28 Pages: 3

Assignors

SHIRONO, TAKASHI

Executed: 2016-10-13

FUJII, MIKA

Executed: 2016-10-13

HIGASHI, KAZUYUKI

Executed: 2016-10-18

Assignee

KABUSHIKI KAISHA TOSHIBA

1-1, SHIBAURA 1 CHOME, MINATO KU, TOKYO, 105-8001, JAPAN

Covered Property (1)

Method of Manufacturing Semiconductor Device Including Thinning Wafer and Beveled Portion Therof

Application: 15/233,920 →

Publication: US 2017/0076969

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.