Patent Assignment
Reel/Frame 040190/0854
Assignment of Assignor's Interest
Recorded: 2016-11-01
Pages: 4
Assignor
KWON, HEUNG KYU
Executed: 2015-10-30
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Chip, Flip Chip Package and Wafer Level Package Including the Same