Patent Assignment
Reel/Frame 040231/0189
Assignment of Assignor's Interest
Recorded: 2016-11-04
Pages: 2
Assignors
LIN, CHIA-HUNG
Executed: 2016-10-18
LIN, LIH-WEI
Executed: 2016-10-18
TSENG, I-HSIEN
Executed: 2016-10-18
TSAI, TSUNG-HUAN
Executed: 2016-10-18
Assignee
WINBOND ELECTRONICS CORP.
NO. 8, KEYA 1ST RD., DAYA DISTRICT, CENTRAL TAIWAN SCIENCE PARK, TAICHUNG CITY, TAIWAN
Covered Property
(1)
Method for Forming Memory Device
Patent:
9,691,980 →
Application:
15/332,393 →