Assignment of Assignor's Interest

Recorded: 2016-11-09 Pages: 3

Assignor

TAKAKU, SATORU

Executed: 2016-10-12

Assignee

KABUSHIKI KAISHA TOSHIBA

1-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO, 105-8001, JAPAN

Covered Property (1)

Semiconductor Device with a Resin Layer and Method of Manufacturing the Same

Application: 15/253,747 →

Publication: US 2017/0133344

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.