Patent Assignment
Reel/Frame 040404/0826
Assignment of Assignor's Interest
Recorded: 2016-11-22
Pages: 6
Assignors
DESAI, KISHOR
Executed: 2013-08-12
KACHRU, RAVINDER
Executed: 2013-08-12
PATEL, VIPULKUMAR
Executed: 2013-08-12
DAMA, BIPIN
Executed: 2013-08-12
SHASTRI, KALPENDU
Executed: 2013-08-12
PATHAK, SOHAM
Executed: 2013-08-12
Assignee
CISCO TECHNOLOGY, INC.
170 WEST TASMAN DRIVE, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Molded Glass Lid for Wafer Level Packaging of Opto-Electronic Assemblies