Patent Assignment
Reel/Frame 040454/0631
Assignment of Assignor's Interest
Recorded: 2016-11-29
Pages: 2
Assignors
VISWANATHAN, LAKSHMINARAYAN
Executed: 2016-11-28
MAALOUF, ELIE A.
Executed: 2016-11-28
TUCKER, GEOFFREY
Executed: 2016-11-28
Assignee
NXP USA, INC.
6501 WILLIAM CANNON DRIVE WEST, AUSTIN, TEXAS, 78735
Covered Property
(1)
Microelectronic Modules with Sinter-Bonded Heat Dissipation Structures and Methods for the Fabrication Thereof