IP Library › Assignment 040459/0134
Patent Assignment
Reel/Frame 040459/0134

Assignment of Assignor's Interest

Recorded: 2016-11-30 Pages: 3
Assignor
ÅAC MICROTEC AB
Executed: 2016-11-08
Assignee
SILEX MICROSYSTEMS AB
P.O. BOX 595, JÄRFÄLLA, SE-175 26, SWEDEN
Covered Properties (3)
Low Resistance Through-Wafer Via
Patent: 8,338,957 →
Application: 12/452,468 →
Publication: US 2010/0133697
Method for Making via Interconnection
Patent: 8,742,588 →
Application: 13/124,003 →
Publication: US 2011/0201197
Low Resistance Through-Wafer Via
Patent: 8,871,641 →
Application: 13/692,303 →
Publication: US 2013/0164935
Related Assignments (3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 29, 2011
From: NILSSON, PETER; LEIB, JURGEN; THORSLUND, ROBERT
To: AAC MICROTEC AB
Reel/Frame 026521/0893 →
Assignment of Assignor's Interest Nov 15, 2012
From: NILSSON, PETER
To: AAC MICROTEC AB
Reel/Frame 029300/0942 →
Assignment of Assignor's Interest Nov 28, 2016
From: NILSSON, PETER
To: ÅAC MICROTEC AB
Reel/Frame 040431/0760 →