IP Library › Assignment 040465/0807
Patent Assignment
Reel/Frame 040465/0807

Assignment of Assignor's Interest

Recorded: 2016-11-30 Pages: 3
Assignor
HITACHI, LTD.
Executed: 2016-09-30
Assignee
SII SEMICONDUCTOR CORPORATION
8, NAKASE 1-CHOME, MIHAMA-KU CHIBA-SHI, CHIBA, 261-8507, JAPAN
Covered Properties (3)
Semiconductor Integrated Circuit Device and Semiconductor Integrated Circuit
Patent: 7,053,670 →
Application: 10/751,917 →
Publication: US 2004/0150459
Manufacturing Method of Semiconductor Apparatus and Semiconductor Apparatus, Power Converter Using the Same
Patent: 7,875,509 →
Application: 12/103,921 →
Publication: US 2008/0265331
Transmission Circuit for Ultrasonic Diagnosis and Method for Transmitting Ultrasonic Wave
Application: 15/050,584 →
Publication: US 2017/0150946
Related Assignments (3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 23, 2016
From: YOSHIZAWA, HIROYASU; HANAZAWA, SATOSHI; ODAWARA, TATSUYA; LI, NA
To: HITACHI, LTD.
Reel/Frame 037794/0233 →
Change of Name Mar 12, 2018
From: SII SEMICONDUCTOR CORPORATION
To: ABLIC INC.
Reel/Frame 045567/0927 →
Change of Address Jun 8, 2023
From: ABLIC INC.
To: ABLIC INC.
Reel/Frame 064021/0575 →