Patent Assignment
Reel/Frame 040487/0656
Assignment of Assignor's Interest
Recorded: 2016-12-01
Pages: 5
Assignors
HUANG, PENG
Executed: 2016-11-18
LI, JUN
Executed: 2016-11-18
DAI, HONGGANG
Executed: 2016-11-18
GU, GUANGUAN
Executed: 2016-11-18
Assignees
SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
18 ZHANG JIANG ROAD, PUDONG NEW AREA, SHANGHAI, 201203, CHINA
SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION
18 WEN CHANG ROAD, ECONOMICAL-TECHNOLOGICAL, DEVELOPMENT AREA, DAXING DISTRICT, BEIJING, 100176, CHINA
Covered Property
(1)
Method of Manufacturing an Eeprom Device