Patent Assignment
Reel/Frame 040487/0735
Assignment of Assignor's Interest
Recorded: 2016-12-01
Pages: 2
Assignors
CHENG, HSI-KUEI
Executed: 2016-11-11
CHANG, CHING FU
Executed: 2016-11-14
HAN, CHIH-KANG
Executed: 2016-11-11
HUANG, HSIN-CHIEH
Executed: 2016-11-17
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Package Structure and Method of Forming the Same