Patent Assignment
Reel/Frame 040594/0852
Assignment of Assignor's Interest
Recorded: 2016-12-07
Pages: 2
Assignor
INTEL CORPORATION
Executed: 2016-12-06
Assignee
INTEL IP CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Methods and Structures for Dicing Integrated Circuits from a Wafer
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 5, 2016
From: MICCOLI, GIUSEPPE
To: INTEL CORPORATION
Reel/Frame 039949/0573 →
Assignment of Assignor's Interest
Jun 9, 2021
From: INTEL IP CORPORATION
To: INTEL CORPORATION
Reel/Frame 057254/0415 →
Assignment of Assignor's Interest
Jul 23, 2021
From: INTEL IP CORPORATION
To: INTEL CORPORATION
Reel/Frame 056972/0439 →