Patent Assignment
Reel/Frame 040662/0063
Assignment of Assignor's Interest
Recorded: 2016-12-19
Pages: 5
Assignors
EISELE, RONALD
Executed: 2016-11-04
MIRIC, ANTON-ZORAN
Executed: 2016-11-04
KRUGER, FRANK
Executed: 2016-11-06
SCHMITT, WOLFGANG
Executed: 2016-11-11
Assignee
HERAEUS DEUTSCHLAND GMBH & CO. KG
HERAEUSSTRASSE 12-14, HANAU, 63450, GERMANY
Covered Property
(1)
Semiconductor Module Comprising an Encapsulating Compound That Covers at Least One Semiconductor Component
Application:
15/319,281 →
Publication:
US 2017/0133291