Patent Assignment
Reel/Frame 040716/0304
Assignment of Assignor's Interest
Recorded: 2016-12-12
Pages: 3
Assignee
QUORA TECHNOLOGY, INC.
2306 WALSH AVENUE, SANTA CLARA, CALIFORNIA, 95051
Covered Property
(1)
Lift Off Process for Chip Scale Package Solid State Devices on Engineered Substrate
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.