Patent Assignment
Reel/Frame 040727/0882
Assignment of Assignor's Interest
Recorded: 2016-12-13
Pages: 3
Assignors
XU, SHUNCHENG
Executed: 2016-10-26
LIANG, ZHIYONG
Executed: 2016-10-26
CAI, BINGJIE
Executed: 2016-10-26
Assignee
XIANGNENG HUALEI OPTOELECTRONIC CO., LTD
NONFERROUS METALS INDUSTRIAL PARK, BAILU TOWN, DISTRICT OF SUXIAN, CHENZHOU, HUNAN PROVINCE, CHENZHOU, CHINA
Covered Property
(1)
Manufacturing Method of Flip-Chip Structure of Group Iii Semiconductor Light Emitting Device