Patent Assignment
Reel/Frame 040774/0760
Assignment of Assignor's Interest
Recorded: 2016-12-27
Pages: 4
Assignors
SUGIYAMA, MASAHIDE
Executed: 2016-12-12
YAMADA, RYUSUKE
Executed: 2016-12-06
KIKUCHI, TATSUYA
Executed: 2016-12-06
YAMANAKA, YASUSHI
Executed: 2016-12-06
Assignee
MITSUBISHI ENGINEERING-PLASTICS CORPORATION
9-2, HIGASHI-SHINBASHI 1-CHOME, MINATO-KU, TOKYO, 105-0021, JAPAN
Covered Property
(1)
Composition for Forming Laser Direct Structuring Layer, Kit, and Method for Manufacturing Resin Molded Article with Plated Layer
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.