Patent Assignment
Reel/Frame 040831/0737
Assignment of Assignor's Interest
Recorded: 2016-12-06
Pages: 6
Assignors
MURAI, MAKOTO
Executed: 2016-11-17
TAKAOKA, YUJI
Executed: 2016-11-17
SATO, KAZUKI
Executed: 2016-11-18
YAMADA, HIROYUKI
Executed: 2016-11-17
Assignee
SONY CORPORATION
1-7-1 KONAN, MINATO-KU, TOKYO, 1080075, JAPAN
Covered Property
(1)
Semiconductor Chip Mounted on a Packaging Substrate