Patent Assignment
Reel/Frame 040843/0781
Assignment of Assignor's Interest
Recorded: 2017-01-04
Pages: 4
Assignors
FANG, LI-CHIH
Executed: 2016-12-01
CHANG, CHIA-WEI
Executed: 2016-12-01
LIN, KUO-TING
Executed: 2016-12-01
CHUANG, YONG-CHENG
Executed: 2016-12-01
Assignee
POWERTECH TECHNOLOGY INC.
NO. 26, DATONG RD., HSINCHU SCIENCE PARK, HUKOU SHIANG, HSINCHU, TAIWAN
Covered Property
(1)
Thin Fan-Out Multi-Chip Stacked Packages and the Method for Manufacturing the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.