Patent Assignment
Reel/Frame 041006/0665
Assignment of Assignor's Interest
Recorded: 2017-01-18
Pages: 8
Assignors
SACHS, EMANUEL M.
Executed: 2016-12-21
JONCZYK, RALF
Executed: 2016-12-22
LORENZ, ADAM L.
Executed: 2016-12-21
WALLACE, RICHARD L.
Executed: 2016-12-21
HUDELSON, G.D. STEPHEN
Executed: 2016-12-21
Assignee
1366 TECHNOLOGIES, INC.
6 PRESTON COURT, BEDFORD, MASSACHUSETTS, 01730
Covered Properties
(3)
Methods and Apparati for Making Thin Semi-Conductor Wafers with Locally Controlled Regions That Are Relatively Thicker Than Other Regions and Such Wafers
Patent:
10,072,351 →
Application:
15/306,787 →
Publication:
US 2017/0051429
PCT:
PCT/US2015/026389 ↗
Methods and Apparati for Automated Manufacture of Kerfless Wafers
Application:
61/986,388 →
Techniques, Methods and Apparati for Automated Manufacture of Kerfless Wafers
Application:
62/011,866 →
Related Assignments
(2)
Other recorded transfers of the patents in this record — the chain of ownership.