IP Library Assignment 041007/0286
Patent Assignment
Reel/Frame 041007/0286

Assignment of Assignor's Interest

Recorded: 2017-01-18 Pages: 6
Assignors
JIA, YANFENG
Executed: 2017-01-10
TANG, LEI
Executed: 2017-01-13
XIE, PENGFEI
Executed: 2017-01-10
Assignee
HUAWEI TECHNOLOGIES CO., LTD.
HUAWEI ADMINISTRATION BUILDING, BANTIAN, LONGGANG DISTRICT, SHENZHEN, 518129, CHINA
Covered Property (1)
Method for Detecting Substrate Crack, Substrate, and Detection Circuit
Patent: 9,983,452 →
Application: 15/326,308 →
Publication: US 2017/0199439
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 13, 2021
From: HUAWEI TECHNOLOGIES CO., LTD.
To: HONOR DEVICE CO., LTD.
Reel/Frame 055919/0344 →