Patent Assignment
Reel/Frame 041025/0473
Assignment of Assignor's Interest
Recorded: 2017-01-20
Pages: 3
Assignee
MEDIATEK INC.
NO. 1, DUSING RD. 1ST, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300, TAIWAN
Covered Property
(1)
Semiconductor Package Assembly with Redistribution Layer (Rdl) Trace