Patent Assignment
Reel/Frame 041089/0826
Assignment of Assignor's Interest
Recorded: 2016-12-21
Pages: 7
Assignors
EOM, DA-IL
Executed: 2016-08-11
KIM, JEONG-IK
Executed: 2016-08-11
KU, JA-HUM
Executed: 2016-08-11
KIM, CHUL-SUNG
Executed: 2016-08-11
PARK, JUN-KI
Executed: 2016-08-11
HYUN, SANG-JIN
Executed: 2016-08-26
Assignee
SAMSUNG ELECTRONICS CO., LTD
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device Including Contact Plug and Method of Manufacturing the Same