Patent Assignment
Reel/Frame 041115/0759
Assignment of Assignor's Interest
Recorded: 2017-01-30
Pages: 3
Assignee
IBIDEN CO., LTD.
1, KANDACHO 2-CHOME, OGAKI, GIFU, 503-8604, JAPAN
Covered Property
(1)
Wiring Board and Method for Manufacturing the Same