Patent Assignment
Reel/Frame 041124/0086
Assignment of Assignor's Interest
Recorded: 2017-01-30
Pages: 11
Assignors
ASHRAFZADEH, AHMAD
Executed: 2013-11-18
ULLAL, VIJAY
Executed: 2013-11-18
CHIANG, JUSTIN
Executed: 2013-11-25
KINZER, DANIEL
Executed: 2013-11-18
DUBE, MICHAEL M.
Executed: 2013-12-10
JEON, OSEOB
Executed: 2013-11-19
WU, CHUNG-LIN
Executed: 2013-11-18
ESTACIO, MARIA CRISTINA
Executed: 2013-11-19
Assignee
FAIRCHILD SEMICONDUCTOR CORPORATION
3030 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
An Improved Package Including a Semiconductor Die and a Capacitive Component
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement
Sep 19, 2016
From: FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 040075/0644 →
Assignment of Assignor's Interest
Aug 3, 2021
From: FAIRCHILD SEMICONDUCTOR CORPORATION
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 057694/0374 →
Release of Security Interest
Oct 28, 2021
From: DEUTSCHE BANK AG NEW YORK BRANCH
To: FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 057969/0206 →
Security Interest
Nov 12, 2021
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 058871/0799 →
Release of Security Interest in Patents Recorded at Reel 040075, Frame 0644
Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064070/0536 →
Release of Security Interest in Patents Recorded at Reel 058871, Frame 0799
Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 065653/0001 →