Patent Assignment
Reel/Frame 041137/0518
Assignment of Assignor's Interest
Recorded: 2017-01-31
Pages: 3
Assignor
TAGUCHI, YASUHIRO
Executed: 2017-01-23
Assignee
SII SEMICONDUCTOR CORPORATION
8, NAKASE 1-CHOME, MIHAMA-KU, CHIBA-SHI, CHIBA, 261-8507, JAPAN
Covered Property
(1)
Resin-Encapsulated Semiconductor Device
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.