Patent Assignment
Reel/Frame 041156/0537
Assignment of Assignor's Interest
Recorded: 2017-02-02
Pages: 3
Assignor
KON, JUNICHI
Executed: 2016-12-28
Assignee
FUJITSU LIMITED
1-1, KAMIKODANAKA 4-CHOME, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA, 211-8588, JAPAN
Covered Property
(1)
Bump-Forming Material, Method for Producing Electronic Component, Method for Producing Semiconductor Device, and Semiconductor Device
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.