Patent Assignment
Reel/Frame 041243/0198
Assignment of Assignor's Interest
Recorded: 2017-02-13
Pages: 6
Assignors
CHEN, TIEN-SZU
Executed: 2017-02-07
CHEN, KUANG-HSIUNG
Executed: 2017-02-07
WANG, SHENG-MING
Executed: 2017-02-07
WANG, I-CHENG
Executed: 2017-02-06
SYU, WUN-JHENG
Executed: 2017-02-06
PENG, YU-TZU
Executed: 2017-02-06
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Device Package and Method of Manufacturing the Same