Patent Assignment
Reel/Frame 041320/0439
Assignment of Assignor's Interest
Recorded: 2017-02-21
Pages: 6
Assignors
CHANG, WON-GI
Executed: 2016-12-23
LEE, DONGWON
Executed: 2016-12-23
KANG, MYUNG-SUNG
Executed: 2016-12-23
YOO, HYEIN
Executed: 2016-12-23
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device Having Stacked Semiconductor Chips and Method for Fabricating the Same