Patent Assignment
Reel/Frame 041342/0538
Assignment of Assignor's Interest
Recorded: 2017-02-22
Pages: 6
Assignors
HWANG, JI-HWAN
Executed: 2016-09-12
PARK, SANG-SICK
Executed: 2016-09-12
MIN, TAE-HONG
Executed: 2016-09-12
NAM, GEOL
Executed: 2016-09-12
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Having a High Reliability