Patent Assignment
Reel/Frame 041488/0166
Assignment of Assignor's Interest
Recorded: 2017-03-07
Pages: 3
Assignors
LIN, MOU-SHIUNG
Executed: 2002-02-07
LEE, JIN-YUAN
Executed: 2002-02-07
HUANG, CHING-CHENG
Executed: 2002-02-07
Assignee
MEGIC CORPORATION
NO. 21, R&D 1ST RD., SCIENCE-BASED INDUSTRIAL PARK, HSINCHU R.O.C, TAIWAN
Covered Property
(1)
Chip Structure and Process for Forming the Same
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 2, 2008
From: LIN, MOU-SHIUNG; LEE, JIN-YUAN; HUANG, CHING-CHENG
To: MEGICA CORPORATION
Reel/Frame 020457/0558 →
Merger
Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest
Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →
Assignment of Assignor's Interest
Mar 7, 2017
From: MEGIC CORPORATION
To: MEGICA CORPORATION
Reel/Frame 041488/0202 →