Patent Assignment
Reel/Frame 041531/0557
Assignment of Assignor's Interest
Recorded: 2017-03-09
Pages: 2
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Structure and Formation Method of Interconnection Structure of Semiconductor Device Structure