Patent Assignment
Reel/Frame 041557/0850
Assignment of Assignor's Interest
Recorded: 2017-03-13
Pages: 2
Assignors
SONSKY, JAN
Executed: 2017-03-07
DINH, VIET THANH
Executed: 2017-03-07
CLAES, JAN
Executed: 2017-03-07
Assignee
NXP B.V.
HIGH TECH CAMPUS 60, EINDHOVEN, NL-5656 AG, NETHERLANDS
Covered Property
(1)
Semiconductor Device Having a Dielectric Layer with Different Thicknesses and Method for Forming