Patent Assignment
Reel/Frame 041561/0322
Assignment of Assignor's Interest
Recorded: 2017-03-13
Pages: 3
Assignor
YOSHINO, HIDEO
Executed: 2017-03-08
Assignee
SII SEMICONDUCTOR CORPORATION
8, NAKASE 1-CHOME, MIHAMA-KU, CHIBA-SHI, CHIBA, JAPAN
Covered Property
(1)
Semiconductor Device Including an Esd Protection Element
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.